LCP base (for subtractive processes)
Laminated with non-roughened copper foil and LCP film, FCCL offer smooth interfacing and excellent high-frequency characteristics
- Provided width: Max. 510 mm
- Format: Rolls, sheets
![Flexible Copper-Clad Laminates (FCCL)](/contents/wp-content/uploads/2024/01/34_sub_main.webp)
Composition
![Composition](/contents/wp-content/uploads/2024/03/en_34_sub_01.webp)
Low transmission loss
![Low transmission loss](/contents/wp-content/uploads/2024/03/en_34_sub_02.webp)
Achieving good shape for wiring using subtractive method
![Achieving good shape for wiring using subtractive method](/contents/wp-content/uploads/2024/03/en_34_sub_03.webp)
General properties
Item | Conditions | Non-roughened copper foil FCCL |
---|---|---|
Conductor peel strength (N/mm) | 18 µm rolled copper foil at room temperature | 0.6 |
Elongation | 38% | 13% |
Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
Relative dielectric constant | 3.3 | |
Solder heat resistance | 288°C, 10 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values
LCP base (Laminated ultra-thin copper foil with carrier/For fine wiring)
Laminated ultra-thin copper foil with carrier and LCP, FCCL applicable to MSAP
Carrier copper foil can be peeled off easily and evenly.
- Provided width: Max. 510 mm
- Format: Rolls, sheets
![LCP base (Laminated ultra-thin copper foil with carrier/For fine wiring)](/contents/wp-content/uploads/2024/01/34_career_main.webp)
Composition
![Composition](/contents/wp-content/uploads/2024/03/en_34_career_01.webp)
Ultra-thin copper layer lamination with low roughness
![Cross section after peeling off carrier copper foil
Conventional design Rz: 1.3 μm*](/contents/wp-content/uploads/2024/03/en_34_career_02.webp)
Conventional design Rz: 1.3 μm*
![Cross section after peeling off carrier copper foil
Low roughness design Rz: 0.9 μm*](/contents/wp-content/uploads/2024/03/en_34_career_03.webp)
Low roughness design Rz: 0.9 μm*
Copper foil manufacturer’s nominal roughness
Achieves fine wiring using MSAP
![Achieves fine wiring using MSAP](/contents/wp-content/uploads/2024/03/en_34_career_04.webp)
General properties
Item | Conditions | Copper foil with carrier FCCL |
---|---|---|
Conductor peel strength | 18 µm thickness after plating At room temperature JIS C 6481 | 1.0 N/mm |
Cross section after peeling off carrier copper foil | room temperature | 0.03 N/mm |
Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
Relative dielectric constant | 3.3 | |
Solder heat resistance | 288°C, 10 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values
LCP base (Ultra-thin plating/For fine wiring)
Ultra-thin copper of 0.1 to 0.3 μm laminated on LCP by non-electrolytic plating
FCCL enables fine wiring processing and excels in high-frequency characteristics
FCCL enables fine wiring processing and excels in high-frequency characteristics
![LCP base (Ultra-thin plating/For fine wiring)](/contents/wp-content/uploads/2024/01/34_plating_main.webp)
Composition
![Composition](/contents/wp-content/uploads/2024/03/en_34_plating_01.webp)
Excellent high-frequency characteristics achieved by interface smoothing
![Excellent high-frequency characteristics achieved by interface smoothing](/contents/wp-content/uploads/2024/03/en_34_plating_02.webp)
Achieves fine wiring using SAP
![Achieves fine wiring using SAP](/contents/wp-content/uploads/2024/03/en_34_plating_03.webp)
General properties
Item | Conditions | Non-electrolytic copper plating (FCCL) |
---|---|---|
Conductor peel strength | 18 µm thickness after plating At room temperature | 0.7 N/mm |
18 µm thickness after plating After 168 hours at 150°C | 0.7 N/mm | |
Dielectric dissipation factor | Open resonant Fabry–Perot method 28GHz | 0.002 |
Relative dielectric constant | 3.3 | |
Solder heat resistance | 260°C, 5 seconds | No abnormality |
The above data are representative values measured by our company, not guaranteed values